Submission Details
Arise的HWBOT Prime成绩 - 发烧友联盟
3984 pps 和 Qualcomm Snapdragon 801 MSM8974AC v3 2457MHz 在 3033MHz
排名位置
n/a
全球4x CPU排名:
1st
Snapdragon 801 MSM8974AC v3 2457MHz 排名:
Points earned for overclocker league
-
全球分数(UGP)
Not Arise's best submission
-
硬件分数(UHP)
1st 使用 Snapdragon 801 MSM8974AC v3 2457MHz
Points earned for team league
-
全球战队能量分 (GTPP) Not lab501.ro's best submission
0.0 积分
-
硬件战队能量分(HTPP) 1st 战队使用Snapdragon 801 MSM8974AC v3 2457MHz
0.0 积分
硬件细节
设备详情
- Model: One A0001 16GB
- Stock OS: Google Android 4.4.2 (KitKat)
- Installed OS:
- Display: 1080 x 1920
- SoC: Snapdragon 801 MSM8974AC v3
- Kernel: Linux version 3.4.0-cyanogenmod (Boeffla-Kernel-2.0-beta11-CMs-bacon-sm484-20141126@kernel) (gcc version 4.8.4 20141027 (prerelease) (SaberMod-4.8.4_arm-graphite) ) #1 SMP PREEMPT Sun Nov 30 07:52:36 PST 2014
CPU细节
- 型号: Qualcomm Snapdragon 801 MSM8974AC v3 2457MHz 'Krait 400'
- 温度: 44 (负载)15 (空载)
- Cores: 3,033MHz(+23.44%)
内存细节
显卡细节
- 型号: Adreno 330 (Adreno) Qualcomm
- 速度:: 0MHz / 0MHz ()
近期的评论
Hiwa 说:
and still air... nice one man
Arise 说:
I'm a little bit reluctant to try and test benching in low temperature environments.
I'm just curious how you are cooling your phone, I've studied the LG G3 Disassembly Teardown guides available on the internet and it seems that the tiny Qualcomm CPU is actually beneath the motherboard directly under display. So what exactly are you cooling in your screenshots, looks to me you have some frosting on your battery.
Massman 说:
Nice, 3G on air
Hiwa 说:
Some time ago on hd7970 we used spacer between gpu and gpu pot, was a small piece of copper, I have that spacer mounted somehow on cpu and I am cooling the other part of motherboard using one more spacer, ss mounted on the second spacer, so basically I am cooling whole the board but cpu more than other parts because the copper spacer, this method works max for 10 minutes then I have shutdown.
Arise 说:
I'm looking at this website:
https://www.ubreakifix.com/blog/lg-g3-teardown/
As you open the phone, the first on the board can be seen the storage NAND memory:
(Orange) Toshiba THGBMBG8D4KBAIR 32 GB on-board NAND flash memory
Then if we flip the board we can see the big chip in the center:
(Orange) SK Hynix 2GB/3GB LPDDR3 RAM layered on the 2.5 GHz quad-core Snapdragon 801 processor.
So are you saying your are cooling with the copper shim the 32 GB on-board NAND and the cold passes through it and cools the GPU on the other side of the board?
Can't understand your explanation...
matose 说:
Great score! Keep up the good work!
Hiwa 说:
one spacer in back one in front where ss mounted. - 25 on ss is about 5 degrees on chipset measured with probe. Will take more pictures next time I try. What your binning cpu numbers?
Arise 说:
About voltages can't really say, I'm still experimenting, but 1.2V are the defaults @3033MHz.
请登录或注册后才能评论