Submission Details
Le score de Arise sur HWBOT Prime - Enthusiast League
3984 pps avec Qualcomm Snapdragon 801 MSM8974AC v3 2457MHz à 3033MHz
Position dans le classement
n/a
Global 4x CPU classement:
1st
Snapdragon 801 MSM8974AC v3 2457MHz classement:
1st sur un total de 291
Points earned for overclocker league
-
Points Global (UGP)
Not Arise's best submission
-
Points Hardware (UHP)
1st utilisant Snapdragon 801 MSM8974AC v3 2457MHz
Points earned for team league
-
Points Global Team Power (GTPP) Not lab501.ro's best submission
0.0 Points
-
Points Hardware Team Power (HTPP) 1st en équipe utilisant Snapdragon 801 MSM8974AC v3 2457MHz
0.0 Points
Détails matériel
Device details
- Model: One A0001 16GB
- Stock OS: Google Android 4.4.2 (KitKat)
- Installed OS:
- Display: 1080 x 1920
- SoC: Snapdragon 801 MSM8974AC v3
- Kernel: Linux version 3.4.0-cyanogenmod (Boeffla-Kernel-2.0-beta11-CMs-bacon-sm484-20141126@kernel) (gcc version 4.8.4 20141027 (prerelease) (SaberMod-4.8.4_arm-graphite) ) #1 SMP PREEMPT Sun Nov 30 07:52:36 PST 2014
Détails Processeur
- Modèle: Qualcomm Snapdragon 801 MSM8974AC v3 2457MHz 'Krait 400'
- Temperature (°C): 44 (charge)15 (repos)
- Cores: 3 033MHz(+23.44%)
Détails mémoire
Détails carte graphique
- Modèle: Adreno 330 (Adreno) Qualcomm
- Fréquence: 0MHz / 0MHz (Stock)
Commentaires récents
Hiwa dit :
and still air... nice one man
Arise dit :
I'm a little bit reluctant to try and test benching in low temperature environments.
I'm just curious how you are cooling your phone, I've studied the LG G3 Disassembly Teardown guides available on the internet and it seems that the tiny Qualcomm CPU is actually beneath the motherboard directly under display. So what exactly are you cooling in your screenshots, looks to me you have some frosting on your battery.
Massman dit :
Nice, 3G on air
Hiwa dit :
Some time ago on hd7970 we used spacer between gpu and gpu pot, was a small piece of copper, I have that spacer mounted somehow on cpu and I am cooling the other part of motherboard using one more spacer, ss mounted on the second spacer, so basically I am cooling whole the board but cpu more than other parts because the copper spacer, this method works max for 10 minutes then I have shutdown.
Arise dit :
I'm looking at this website:
https://www.ubreakifix.com/blog/lg-g3-teardown/
As you open the phone, the first on the board can be seen the storage NAND memory:
(Orange) Toshiba THGBMBG8D4KBAIR 32 GB on-board NAND flash memory
Then if we flip the board we can see the big chip in the center:
(Orange) SK Hynix 2GB/3GB LPDDR3 RAM layered on the 2.5 GHz quad-core Snapdragon 801 processor.
So are you saying your are cooling with the copper shim the 32 GB on-board NAND and the cold passes through it and cools the GPU on the other side of the board?
Can't understand your explanation...
matose dit :
Great score! Keep up the good work!
Hiwa dit :
one spacer in back one in front where ss mounted. - 25 on ss is about 5 degrees on chipset measured with probe. Will take more pictures next time I try. What your binning cpu numbers?
Arise dit :
About voltages can't really say, I'm still experimenting, but 1.2V are the defaults @3033MHz.
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