- LG Electronics Inc G3 D858 TD-LTE (LG B2)
Hardware details
- Snapdragon 801 MSM8974AC v3
- System-On-Chip
- 3072MB
- Memory
- 146 x 74 x 9mm
- HxWxD Dimensions
- 153 gramms
- Mass
- Kernel
- 11 Aug, 2014
- Release date
- USB 2.0 host/client, 480Mbit/s, OTG 1.3, micro-USB
- USB Connection
Snapdragon 801 MSM8974AC v3 2457MHz Benchmarks
CPU overclocking records
World records achieved by overclocking a Qualcomm Snapdragon 801 MSM8974AC v3 2457MHz processor. Click on view more to see the complete hall of fame.
Adreno 330 Benchmarks
GPU overclocking records
World records achieved by overclocking a Qualcomm Adreno 330 videocard. Click on view more to see the complete hall of fame.