EK Releases Its First LN2 Evaporation Cooler - EK-SF3D Triple Point EVO Now Available!

EK Water Blocks, Ljubljana based premium water cooling gear manufacturer, is proud to introduce EK-SF3D Triple Point EVO, company's first product from the line of liquid nitrogen (LN2) evaporation cooler for competitive overclockers. Used in conjunction with up to four Module Adapters this unit allows extreme overclocking of virtually any (DDR-)SDRAM memory module (of any generation).

EK-SF3D Triple Point EVO is a product of joint venture between Petri 'SF3D' Korhonen, legendary overclocker and extreme evaporation cooler designer from Finland, and EK design & engineering team. The product is made of electrolytic grade nickel plated copper in order to provide the necassery mass to even out the temperature fluctuation. Top extension is made from high quality POM Acetal - with it's poor thermal conductivity it is better at preventing unwanted condensation formation that many overclockers are not fond of.

Bundled with the evaporation cooler itself are the two (2) EK-SF3D Triple Point Module Adapter heatsinks. Each of these items are made of CNC machined high quality aluminium and feature black anodized finish. Heat transfer between the memory module and aluminium heatsink adapter and copper base of the EK-SF3D Triple Point EVO is ensured by the use of enclosed Gelid GC-Extreme TIM (grease).

Full Press Release: http://hwbot.org/news/9538_ek_releases_its_first_ln2_evaporation_cooler


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Belgium Massman says:

Finally available - looks great! :celebration:

United States sin0822 says:

It looks awesome! Courtesy of Jorge from TPU Forums in response to this LN2 pot post at TPU news section.

LN2 overclocking is for people with too much time on their hands. They should get a real job and spend some quality time with real people. ;)
Nice. It never ceases to amaze me how judgmental people are when they don't know, that coming from a guy who sits on TPU all day and posts online lol.

United States Bobnova says:

Awesome! Judgmental people are ridicules.

Finland Luumi says:

Looks awesome! I wonder what people will achieve on the upcoming 1150 platform ;).

S_A_V says:

My first impression about Triple Point EVO:
[+] Copper base of the pot.
[+] Price is good (especially for those who live outside of EU and don't need to pay VAT) and cheap shipping from EK shop.
[+] Quality is good (like other EK products).
[+] Looks nice.
[-] Small internal volume (top extension walls are too fat and small). I understand it was done to reduce condensation around the top extension, but we will need to insulate base part and module adapters anyway.
[-] Module adapter still made of aluminium. Why not make copper version of module adapters too? If price will be little bigger that is not a problem (for those who need cheap can choose original version with aluminium module adapters).
[COLOR="Silver"][SIZE="2"][-] Only two module adapters bundled with the pot. Why not make module adapter available for sale separately, or even better two versions of triple point - with 2 and 4 module adapters included. Difference between 2 and 4 modules is about 1 second in Super Pi 32M (33% of the difference in performance between air cooled and ln2 cooled memory).[/SIZE][/COLOR] - fixed.

Pls don't think like I'm a KPC fan or so. Yes, I really like my Venom and Ney Pro, but I also like Der8auer RAPTOR3 and EK-SF3D Triple Point EVO.
Anyway, it is better for all of us that we have choice and competition on the LN2 cooling market.
Triple Point EVO is not ideal from my point of view (like any other product - everything have their pros and cons), but I clearly see the progress in memory pot development here.
It's the best SF3D product so far - much better than Inflection Point EVO.

Australia Dinos22 says:

looks nice. i'll stick it up on GBT Tech Daily since you used a great looking motherboard with it :D

Slovenia tiborrr says:

S_A_V said: My first impression about Triple Point EVO:
[+] Copper base of the pot.
[+] Price is good (especially for those who live outside of EU and don't need to pay VAT) and cheap shipping from EK shop.
[+] Quality is good (like other EK products).
[+] Looks nice.
[-] Small internal volume (top extension walls are too fat and small). I understand it was done to reduce condensation around the top extension, but we will need to insulate base part and module adapters anyway.
[-] Module adapter still made of aluminium. Why not make copper version of module adapters too? If price will be little bigger that is not a problem (for those who need cheap can choose original version with aluminium module adapters).
[-] Only two module adapters bundled with the pot. Why not make module adapter available for sale separately, or even better two versions of triple point - with 2 and 4 module adapters included. Difference between 2 and 4 modules is about 1 second in Super Pi 32M (33% of the difference in performance between air cooled and ln2 cooled memory).

Pls don't think like I'm a KPC fan or so. Yes, I really like my Venom and Ney Pro, but I also like Der8auer RAPTOR3 and EK-SF3D Triple Point EVO.
Anyway, it is better for all of us that we have choice and competition on the LN2 cooling market.
Triple Point EVO is not ideal from my point of view (like any other product - everything have their pros and cons), but I clearly see the progress in memory pot development here.
It's the best SF3D product so far - much better than Inflection Point EVO.

Hello SAV,

thanks for your honest opinion. Such balanced opinions coming from competitive overclocker as yourself is always valued :o. I will just skip to some of your cons:
[-] Small internal volume (top extension walls are too fat and small).
[-] Module adapter still made of aluminium.
[-] Only two module adapters bundled with the pot.

1. No need for bigger internal volume, under 2V load the drop is about 0.1°C per second. Initial pulldown on warm, dry start is about 3°C/s
2. Since the IC is packed inside the bakelite housing which has poor thermal conductivity there is no point in making copper adapters. Granted the copper adapter would have higher mass and would *maybe* be easier to control the temperature but that's about it.
3. Additional pair can be purchased separately: http://www.ekwb.com/shop/ek-sf3d-triple-point-evo-module-black-2pcs.html

Also, If you are interested in Inflection Point EVO feel free to PM me, I may have a proposition for you.

Regards,
Niko :cool:

S_A_V says:

tiborrr said: Hello SAV,

thanks for your honest opinion. Such balanced opinions coming from competitive overclocker as yourself is always valued :o. I will just skip to some of your cons:

1. No need for bigger internal volume, under 2V load the drop is about 0.1°C per second. Initial pulldown on warm, dry start is about 3°C/s
2. Since the IC is packed inside the bakelite housing which has poor thermal conductivity there is no point in making copper adapters. Granted the copper adapter would have higher mass and would *maybe* be easier to control the temperature but that's about it.
3. Additional pair can be purchased separately: http://www.ekwb.com/shop/ek-sf3d-triple-point-evo-module-black-2pcs.html

Also, If you are interested in Inflection Point EVO feel free to PM me, I may have a proposition for you.

Regards,
Niko :cool:


1. It's not only about temperatures, but also pot usability. Internal value of the pot does matter when you bench alone multi-pot rig with coldbugless parts (cpu/gpu/ram). When you do something in OS (change setting, running programs, make screenshot, etc) you can easily miss the moment to pour LN2 in the pot. With bigger internal volume you have more time for that, before temperature will rise and system will have BSOD.

2. Hard to say how much copper memory adapters can be better than aluminium ones, before real testing with both of them is done. My opinion based on temperature comparison Kingston HyperX T1 (aluminium) and OCZ Flex XLC (copper) memory heatsinks, both was on air (cooled with additional 92-mm fan). RAM IC doesn't produce so much heat like CPU or GPU, but for extreme overclocking every degree is important.

3. That's fine :) Seems I was inattentive while browsing EK site.

Denmark zzolio says:

can you use the mem pot on Memory with heatsinks

Slovenia tiborrr says:

S_A_V said: 1. It's not only about temperatures, but also pot usability. Internal value of the pot does matter when you bench alone multi-pot rig with coldbugless parts (cpu/gpu/ram). When you do something in OS (change setting, running programs, make screenshot, etc) you can easily miss the moment to pour LN2 in the pot. With bigger internal volume you have more time for that, before temperature will rise and system will have BSOD.

2. Hard to say how much copper memory adapters can be better than aluminium ones, before real testing with both of them is done. My opinion based on temperature comparison Kingston HyperX T1 (aluminium) and OCZ Flex XLC (copper) memory heatsinks, both was on air (cooled with additional 92-mm fan). RAM IC doesn't produce so much heat like CPU or GPU, but for extreme overclocking every degree is important.

3. That's fine :) Seems I was inattentive while browsing EK site.

Hey SAV,

thanks again for the feedback:
1. It is the mass that is important here, not the internal volume. We usually don't run our memory on full-pull LN2 temperatures, correct? And as I said, it is easy to maintain the temperature of the memory within the 5°C range even if you miss out for a minute or so. Higher internal volume does not solve this.

2. The Triple Point EVO has probe slots built in each module separately for more precise control, hence the pot is controlled in regards to how cold the aluminum modules are, not how cold the copper core is. For example, -100°C is -100°C regardless of what material is being used. The bakelite packaging of individual IC would most likely nullify all gains (in terms of thermal performance). It is hard to explain and say what I am actually trying to say because English is not my native language so I hope you understand.

3. :nana:

@zzolio: Not with these adapters you can, these can be done if there is demand. Don't be a wuss, strip those sinks away! :celebration:

Denmark zzolio says:

I have a mem put that fits RAM without heatsinks

I would like to see you remove the heatsinks from Corsair ram

Slovenia tiborrr says:

Buy G.Skill :P On the more serious note: What memory? Corsair Dominator / Dominator GT or Dominator Platinum?

Greece FireKillerGR says:

Wanna know for platinum aswell pls :)

Slovenia tiborrr says:

No, these adapters will not fit the Platinums. We need to make special modules in order to fit the heatsinked memory.

Australia Bullant says:

At first glance of this memory pot I too thought that volume would be a problem as well,now hearing that base is copper I think this is the key to this pot.I say after pull down of this pot even at full pot would require little amount ln2 to keep it at full pot due to the copper base.Is this correct?

Denmark Rosty says:

it looks really nice :)
There are some talented overclockers who could make good pots as we have been able to buy on the forum for a god prize.
To me it seems that EK and SF3D and his team take overclocking scene to the next stage, what overclocking equipment concerned.
It will be so much easier to buy overclocking equipment in Europe, if we can just order the same place as we buys water cooling equipment in the future.

we will order 2 pieces for OcTeamZenZyg and we hope that comes pots for GPU and CPU from EK and SF3D in the future too ;)

will it be possible to buy a heatzink in masiv copper or aluminum,maybe with an angle, so we can make gheto mount from the top or the side with ss and cascade?

Nice work :)

Slovenia tiborrr says:

Bullant is correct. @Rosty: SS/Cascade plate is already in production :)

Belgium skulstation says:

Any chance in modules for fb-dimm's ?

S_A_V says:

tiborrr said: Hey SAV,

thanks again for the feedback:
1. It is the mass that is important here, not the internal volume. We usually don't run our memory on full-pull LN2 temperatures, correct? And as I said, it is easy to maintain the temperature of the memory within the 5°C range even if you miss out for a minute or so. Higher internal volume does not solve this.

2. The Triple Point EVO has probe slots built in each module separately for more precise control, hence the pot is controlled in regards to how cold the aluminum modules are, not how cold the copper core is. For example, -100°C is -100°C regardless of what material is being used. The bakelite packaging of individual IC would most likely nullify all gains (in terms of thermal performance). It is hard to explain and say what I am actually trying to say because English is not my native language so I hope you understand.

3. :nana:

@zzolio: Not with these adapters you can, these can be done if there is demand. Don't be a wuss, strip those sinks away! :celebration:


1. When I'm talking about internal volume, I mean the first phase of defreezing without temperature changes. It starts from the moment when we stop pouring LN2 after going full pot, and it ends when the pot is empty, but still have cold accumulated in pot base.
Of course, mass is important too - it helps to control temperature without fast changes. In the second phase, while pot base start to release accumulated cold, mass affects to the speed of temperature rising.

We don't run full pot only if we have problems with CB or in some cases if cooling part don't likes too low temps (optimal temp > CB or full pot).
I don't have so much experience in subzero memory benching yet. May be coldbugless and perfect temp-scaling memory is rare. My first GSkill kit I have tried can run 32M with 6-9-5 and full pot, but when temp falls to -140C...-150C - it goes unstable even idling.

2. It's good decision to place a hole for thermocouple directly in adapters.
I hope I understand what you mean (my english is far from perfect too). Yes, memory IC (BGA package) don't have the same level of thermal performance like open silicon core (CPU/GPU) has.
That's why I tried to improve surface area of contact between module and adapters, applying rubber eraser all around memory module. Rubber eraser is not only insulating material, but also not bad as thermal conductor.
In this case, memory module is cooled completely, (including PCB) and IC releasing heat in all directions (back side to PCB, sideway to eraser and front side to adapter).

France marmott says:

tiborrr said:
@Rosty: SS/Cascade plate is already in production :)


Great news!

Greece FireKillerGR says:

Just received mine. Looks really good :)
Nice job EK and SF3D

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