Interesting follow-up on the Ivy Bridge TIM debate. What do you guys think about this?
It's proven: the thermal interface material (TIM) used by Intel, inside the integrated heatspreader (IHS) of its Core "Ivy Bridge" processors are behind its higher than expected load temperatures. This assertion was first made in late-April by an Overclockers.com report, and was recently put to test by Japanese tech portal PC Watch, in which an investigator carefully removed the IHS of a Core i7-3770K processor, removed the included TIM and binding grease, and replaced them with a pair of aftermarket performance TIMs, such as OCZ Freeze and Coolaboratory Liquid Pro.
PC Watch findings show that swapping the TIM, if done right, can shave stock clock (3.5 GHz, Auto voltage) temperatures by as much as 18% (lowest temperatures by the Coolaboratory TIM), and 4.00 GHz @ 1.2V temperatures by as much as 23% (again, lowest temperatures on the Coolaboratory TIM). The change in TIM was also change the overclockability of the chip, which was then able to sustain higher core voltages to facilitate higher core clock speeds. The report concluded that Intel's decision to use thermal paste inside the IHS of its Ivy Bridge chips, instead of fluxless solder, poses a very real impact on temperatures and overclockability.