- Huawei Honor 3C 4G TD-LTE H30-L01
Hardware details
- HiSilicon V9R1 KIRIN910 Hi6620
- System-On-Chip
- 1024MB
- Memory
- 139 x 71 x 9mm
- HxWxD Dimensions
- 140 gramms
- Mass
- Kernel
- 27 May, 2014
- Release date
- USB 2.0 host/client, 480Mbit/s, OTG 1.3, micro-USB
- USB Connection
Kirin 910 Hi6620 1600MHz Benchmarks
CPU overclocking records
World records achieved by overclocking a HiSilicon Kirin 910 Hi6620 1600MHz processor. Click on view more to see the complete hall of fame.
ARM Mali-450MP2 Benchmarks
GPU overclocking records
World records achieved by overclocking a ARM ARM Mali-450MP2 videocard. Click on view more to see the complete hall of fame.